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CONTRACT OPPORTUNITIES ADITIONAL INFORMATION

Project reference: 2009-108369

Title: CONTRACT NOTICE FOR THE SUPPLY OF SCIENTIFIC MATERIALS AND INSTRUMENTS

Complementary information: REPLIES TO TECHNICAL QUESTIONS RAISED BY BIDDERS

Date of dispatch : 06-10-2009

Additional information:
a)-item 4.5

When reading the document, some questions raised and we would appreciate if you can give us some inputs in order for us to provide the best offer to your institute.
The initial questions are:

Sample size: there is no mention of the actual maximum sample size to measure with the CIP tester, while this is mentioned in some of the other tool to be supplied. Can you please let us know the wafer holder size expected?

R:200mm diameter compatible

There is no mention of mapping or multi sample capabilities for the CIP tester. Our tool has been designed with embedded mapping capabilities, so we would like to know the travel range requested. If above our standard 150mm X Y range our delivery time may differ. We would appreciate to have that information to provide the most accurate delivery time if not standard 150m XY range based tool.

R:150mm mapping is acceptable, 200mm mapping is desirable

b)-Items 1.4, 1.5, 1.6, and 1.7
hemos visto que tenemos un equipo que les podria interesar, para las posiciones 4,5,6 y 7, a parte de la 3 de la alineadora. Es un equipo que hace las funciones de estas posiciones integrado todo en uno y funcionando con un robot.

R: Items 1.4, 1.5, 1.6, and 1.7 in the tender are aimed at having automated resist coating and developing ( optical and e-beam resists) for 150mm wafers ( 4, 5), and two manual systems for coat/bake and develop/bake for 200mm wafers ( 6,7). You can combine 4 and 5 and
quote one combined system providing you respect the individual specifications in 1.4 and 1.5.

c)-Item 4.1

-The "Programmable Wafer Tester" appears to aimed at electrical
tests. They give some specs for the 8" wafer prober, which I donīt
believe is issue, but they say nothing about the test system that
would be connected to the wafer prober. I suspect that for what
they wish to do, a parametric tester would work. Simple electrical
tests around predefined parameters.

R:The electrical test hardware is not part of this tender.




 
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